Microwave characterization of porous SiOCH permittivity after integration dedicated to the 32nm node

New porous ULK materials are now required for maintaining a constant RC factor as back-end dimensions shrink for each new technology node. Porous SiOCH ULK HF characterization, dedicated to the 32nm node, has been performed, and its complex permittivity extracted up to 8GHz. The impact of process integration on the porous SiOCH is highlighted, by an increase of its real permittivity and unwanted losses.