Innovation Networks and Complex Technologies: Policy Implications of the Unknown, and the Unknowable

An integrated circuit package for demountable attachment to a printed circuit board or like device is formed from an integrated assembly of an IC chip and socket, The IC chip is permanently mounted to a chip carrier which spreads the contact area from a first area to a larger second area. The chip carrier or spreader is contained in a plastic socket formed of a cover and a base. The base has an array of apertures therethrough each of which is equipped with wadded wire/plunger contacts for conformal contact with both pads on the bottom of the chip carrier and pads on a circuit board.