Old Web
English
Sign In
Acemap
>
Paper
>
Triple-Layered Ring Oscillators and Image Sensors Developed by Direct Bonding of SOI Wafers
Triple-Layered Ring Oscillators and Image Sensors Developed by Direct Bonding of SOI Wafers
2019
Goto Masahide
Honda Yuki
Watabe Toshihisa
Hagiwara Kei
Nanba Masakazu
Iguchi Yoshinori
Saraya Takuya
Kobayashi Masaharu
Higurashi Eiji
Toshiyoshi Hiroshi
Hiramoto Toshiro
Keywords:
Direct bonding
Optoelectronics
Ring oscillator
Wafer
Silicon on insulator
Image sensor
Materials science
Oscillation
a d converter
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]