Physical system of ultra-thin chip-level atomic clock

The invention discloses a physical system of an ultra-thin chip-level atomic clock for the purpose of solving the problem of a conventional chip-level atomic clock is high in cost and energy consumption in structure duplication. The physical system of the ultra-thin chip-level atomic clock comprises an LCC base, a physical support frame fixed to the LCC base, a VCSEL system, a photocell and a ceramic sealing cap matching the LCC base for vacuum seal of all parts. The VCSEL system and the photocell are arranged on two opposite sides of the physical support frame. A slide system and an absorbing foam system are arranged between the VCSEL system and the photocell. The slide system draws close to the VCSEL system. The absorbing foam system draws close to the photocell. An electrode and a welding disc used for adapting leading wires are arranged on the physical support frame. A signal of the physical support frame is adapted to a leading wire electrode of the LCC base. The physical system of the ultra-thin chip-level atomic clock is simple in structure and low in cost and lays a solid foundation for large-area promotion and application.