First Integration Steps of Cu-based DNA Nanowires for interconnections

In the wide range of emergent nanotechnologies, DNA-based microelectronics has shown an important potential for components miniaturization and auto-assembling approaches applicable to future silicon-based electronic circuits [1]. In order to pursue the Moore's law, interconnections must be indeed addressed at the nanoscale, with a good control of their size, location and electrical & thermal performances. With its natural auto-assembling property, its 2-nm-double-helix diameter and its several metallization possibilities, DNA is a promising candidate to build bio-inspired electronic components [1]. DNA has been first metallized by Erez Braun in 1998 using a silver electroless method [2]. Since 1998, several groups have worked on DNA metallization using different chemistries with metals such as Pd, Pt, Au, Ag and Cu [3]. Most of these works have presented electrical and morphological characterizations of few metallic nanowires. However, in order to initiate DNA-based-nanowires integration on silicon techno...