Novel Microwave Process for RDL Photosensitive Dielectric Polymer Curing on FOWLP Reconstructed Wafer

Characterization of negative tone and positive tone Photosensitive Dielectric Polymer cured by novel microwave oven, NE, was conducted to apply for Fan-Out-Wafer-Level-Packaging, FOWLP. PIMEL BL-301, negative tone, cured by NE at 180 deg C showed similar properties cured by conventional furnace oven, Furnace, at 200 deg C, and HD-8820, positive tone, cured by NE showed approximately 70 deg C lower than by Furnace. Warpage level and reliability test results of FOWLP showed good enough, when Photosensitive Dielectric Polymer were cured by NE.