High Capacity Silicon Photonics Packaging

A large amount of progress has been made in the industrialization of Silicon Photonics fabricated in CMOS Fabs, enabling the adoption of 100G QSFP modules. Further progress has now increased the transmission capacity of Silicon Photonics devices. In this paper, we outline the package design and evaluation of high capacity Silicon Photonics devices from simulation of the package performance to the prototype packaging results.