Semiconductor package having electro-magnetic interference shielding structure

A semiconductor package is disclosed. The semiconductor package may include a substrate on which a bond finger is disposed. The semiconductor package may include a mounted semiconductor chip in which an active surface on an upper surface of the substrate faces the upper surface of the substrate. The semiconductor chip may include a bonding pad disposed on the active surface and electrically connected to a bond finger. The substrate may include an external signal line disposed on an upper surface of the substrate and having a first end connected to the bond finger. The substrate may include a first ground pattern disposed on an upper surface of the substrate and extending from an area overlapping the semiconductor chip to an edge of the substrate. The substrate may include an internal signal line formed within the substrate and electrically connected to the external signal line. The bond fingers may be arranged to overlap the semiconductor chip. The internal signal line may extend out of the region overlapping the semiconductor chip from the region overlapping the semiconductor chip. The first ground pattern may be disposed so as to overlap the internal signal line extending outside the region overlapping the semiconductor chip.