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Characterization of Coupled Transmission Lines Used in Integrated Circuit Packaging on Printed Circuit Boards
Characterization of Coupled Transmission Lines Used in Integrated Circuit Packaging on Printed Circuit Boards
2014
Nassima Tidjani
J.C. Le Bunetel
Ali Ouchar
Yves Raingeaud
Keywords:
Tape-out
Circuit design
Electric power transmission
Printed circuit board
Electronic engineering
Integrated circuit packaging
Materials science
Electrical engineering
Computer science
Correction
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