Thermophysical Properties of Cu-Matrix Composites Manufactured Using Cu Powder Coated with Graphene

Compact Cu matrix composites reinforced with graphene were prepared by thermochemical processes and cold isostatic pressing. Thermophysical properties were investigated using laser flash analysis, differential scanning calorimetry, and dilatometry. From the results of the measurements, it follows that within the entire investigated temperature range, both the thermal diffusivity and the calculated values therefrom of the thermal conductivity of copper-graphene composites change according to the temperature changes. Above 500 °C, abnormal decrease of the thermal diffusivity was registered for sample prepared from pure copper powder. In this case, the elevated temperature of test could cause sintering of copper particles, which were not coated by graphene. The as-received composites had higher thermal diffusivity and the thermal conductivity at the room temperature in comparison to the material obtained by standard pressing of pure copper powder. However, the production methods of some samples could cause their partial sintering. Based on the study, it could not be concluded that graphene only has impacts on the thermophysical properties.