An introduction of resistive arrays and packaging technology

As an important way to simulate the dynamic infrared scene, the technology of resistive arrays, especially large format resistive arrays are developing very fast. Principle of resistive arrays is introduced. The unit cell is composed by two MOS transistors, a capacitor and a resistor. The resistor is the main element to make infrared radiation by heating. Key parameters, such as temperature, frame rate, uniformity and cross-talk are used to standard to evaluate the performance of the arrays. Several methods to improve the parameters is put forward. In addition, development and current situation of the packaging technology is discussed and analyzed in this paper. At last, the technology developments of resistive arrays and packaging are summed up and an outlook of the future is provided.