Formation of microelectronic bond, bond heat assembling and ultrasonic transducer

PURPOSE: To enable small amplitude vibrating welding with high accuracy and superior positioning by bringing a jointing end of a wire into contact with a bond side by a substantial stroke, to make an interface between the jointing end and the bond site. CONSTITUTION: In a bond head assembling body 16, a wire path hole 27 in an aggregate axis direction is formed, and a wire 12 is sent to a bond site 28 along it, to form a microelectronic bond connection wiring. Thereby sending- out of the wire 12 is protected, substantially-linear downward movement is performed toward the bond site 28. As a result, the bond head assembling body 16 is used for 'deep access' package, etc., and further, the mass of an ultrasonic transducer 25 is reduced. Thereby small amplitude vibrating welding with high accuracy and superior positioning is performed. COPYRIGHT: (C)1993,JPO