Lead frame member and manufacturing method therefor

[Problem] To provide a lead frame member suitable for forming a lead frame in which the resin adhesion in high temperature/high humidity environments that has been sought in recent years can be improved, and a manufacturing method therefor. [Solution] A lead frame member having a roughened layer on an electrically conductive substrate (1), wherein said roughened layer comprises multiple roughened layers, said roughened layer has a vertical roughened layer (2) comprising at least one layer in the vertical direction of the electrically conductive substrate and also has at least one layer of an additional roughened layer (3) above said vertical roughened layer, and, of the respective recesses and protrusions of the vertical roughened layer and the additional roughened layer, the spacing between the vertices of adjacent protrusions of the vertical roughened layer and the spacing between the vertices of adjacent protrusions of the additional roughened layer differ; and a manufacturing method therefor.