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On the Fabrication of Backside Illuminated Image Sensors: Bonding Oxide, Edge Trimming and CMP Rework Routes
On the Fabrication of Backside Illuminated Image Sensors: Bonding Oxide, Edge Trimming and CMP Rework Routes
2015
Celso Cavaco
Lan Peng
Farid Sebaai
Greet Verbinnen
Jakob Visker
Jan Van Olmen
Deniz Sabuncuoglu Tezcan
Haris Osman
Keywords:
Oxide
Rework
Image sensor
Trimming
Fabrication
Electronic engineering
Engineering
Mechanical engineering
Engineering drawing
Correction
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