Moudled circuit module, and production method therefor

The purpose of the present invention is to improve a moulded circuit module, which includes a communication unit among the electronic components mounted to a substrate thereof, and which is provided with a shield layer, such that communication using the communication unit is not hindered. This moulded circuit module is provided with a substrate (100) having, mounted thereto, electronic components (200) including an electronic component (200C), i.e. a communication unit. In the substrate (100), all of the electronic components (200) are covered by a first resin (400). The upper surface of the first resin (400) is covered by a second resin (500). The upper surface of the second resin (500) and the side surfaces of the first resin (400) are covered by a shield layer (600) made from plating which blocks electromagnetic waves. An opening (630) in the shield layer (600) is provided directly above the electronic component (200C), i.e. the communication unit.