Electronic component mfg. method and device, and driving methof for said making device

The present invention provides an easy maintenance, and high precision method for manufacturing an electronic component bent, its driving method and the manufacturing apparatus manufacturing apparatus. Bending mold comprising (D231), movably disposed on the outer side of the folded mode D231 of one pair of bending punches D217 in the horizontal direction. The cam drive member 117 lowered, the bending punch D217 driven in the horizontal direction, is provided at the lead along the horizontal crystal resonator on the bent mold D231 in the direction of pressure, the bottom of the resin molding portion tip of the lead toward the side bent.