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RF effects of LCP on III-V HEMTs for 3D MMICs
RF effects of LCP on III-V HEMTs for 3D MMICs
2008
Swapan K. Bhattacharya
David J. Chung
Ioannis Papapolymerou
Keywords:
Wafer-level packaging
Electronic engineering
Technical report
Materials science
Optoelectronics
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