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Au thin film wafer bonding after degas annealing for MEMS packaging
Au thin film wafer bonding after degas annealing for MEMS packaging
2017
T. Matsumae
Y Kurashima
Hideki Takagi
Keywords:
Wafer bonding
Microelectromechanical systems
Optoelectronics
Thin film
Materials science
Annealing (metallurgy)
Correction
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