Non hermetic microwave packaging : a reality for space application

This paper presents the introduction of the non hermetic encapsulation of microwave hybrids for space application through the development of a new generation of low noise amplifier modules for a feed array fed reflector antenna for multimedia applications in Ka-band. Thanks to the improvement for many years now of organic materials, it is now realistic to propose advanced packaging solutions based on the Chip on Board approach with glob top encapsulation of active devices on printed circuit boards. To validate this packaging approach, reliability test-plans were proposed for each process/material (board substrate, assembly of components, module connection and glob top encapsulation) in agreement with standard space quality requirements. No failure are reported after visual inspection and on electrical characteristics at the end of the reliability test-files.