Chip-last EmbeddedActive forSystem-On-Package (SOP)

Embeddedactive technology, inwhichthinned active chipsaredirectly buried intoa coreorhigh-densityinterconnect layers, isgaining moreinterest forultraminiaturization, increased functionality and better performance ofSOP (System-On-Package). Inthisstudy, chip-last embedded active concept isproposed toaddress someofprocess andreliability issues that current chip-first andchip-middle embedded active approaches have.The detailed process development forthefirst prototype ofchiplast embedded active isdescribed inthis paper.