Semiconductor package sliming apparatus and method of the same

PURPOSE: A semiconductor package sliming apparatus and a method thereof are provided to prevent a concentrated load in a grindstone by uniformly polishing deformed packages. CONSTITUTION: A semiconductor package is mounted on a table (10). A grindstone polishes the semiconductor package. The width of the grindstone is wider than the width of the semiconductor package. Vacuum holes (12) are formed in a vacuum groove (11). The grindstone polishes the molding surface of the semiconductor package.