Resin complex and an adhesive for electroless plating

PROBLEM TO BE SOLVED: To obtain a resin composite, excellent in tensile strength, breaking elongation and fracture toughness, having a low permittivity and useful as an adhesive, etc., for electroless plating by compounding an alicyclic type epoxy resin with a silicone resin. SOLUTION: This resin composite is obtained by compounding (A) an alicyclic type epoxy resin having a structure preferably represented by formula I [(n) is 0-1] and further a permittivity as low as 3.41 with (B) a silicone resin which is preferably a silicone oil e.g. an epoxy group-modified silicone oil represented by formula II [(n) is 1-100]} or a silicone rubber and capable of manifesting a low permittivity at preferably (95/5) to (70/30), more preferably (85/15) to (70/30) weight ratio of the components A/B, dissolving the resultant mixture in a miscible solvent, providing a liquid form, then molding the resultant solution into a prescribed shape, drying the molded product at 50-100 deg.C and carrying out the curing treatment at 170-180 deg.C which is the curing temperature of the alicyclic epoxy resin for about 1-10 hr.