Development of thermally stable NiAg interconnections for application to resistive films

Ni plates coated with a thin film of Sn are interconnected with thick-film Ag conductors at different processing conditions using the isothermal solidification technique. The joints thus produced consist of intermetallic phases and are stable at higher temperatures than their fabrication temperature. Light microscopy and scanning electron microscopy together with wavelength dispersive X-ray analysis of the cross-section of the samples is performed to examine the phase formation at the interfacial regions. Based on these, optimum fabrication parameters for producing mechanically strong joints are obtained.