TAB Tape Carrier with Micro Plating Bumps for Burn-in Testing Socket

The burn-in testing socket for 0.5-mm pitch BGA package is key to packaging technology. We made a new contact substrate for the burn-in testing socket. The substrate consisted of a double metal layer TAB tape carrier that had flexible pattern routing, and many fine plated bumps as contact probes were put on each pad. We also constructed a continuous reel-to-reel bump-plating machine capable of high- speed deposition and maintaining a uniform bump height. The durability and the reliability of the testing socket that was assembled a new tape substrate were better than those of the former 0.8-mm pitch mechanical-contact-type socket.