Silicon wafer refined polishing composition liquid applicable to low pressure and preparation method thereof

The invention relates to silicon wafer refined polishing composition liquid applicable to low pressure and a preparation method thereof, belongs to the field of chemical mechanical polishing, and particularly relates to the silicon wafer refined polishing composition liquid applicable to low pressure. The silicon wafer refined polishing composition liquid comprises colloidal silicon dioxide abrasive particles, a polishing accelerator, a polishing interface control agent, a surfactant, an alkaline compound and deionized water, wherein the pH value of the refined polishing composition liquid is 8 to 12. The silicon wafer refined polishing composition liquid has high removal ratio under low pressure (0.2 to 0.5 psi), achieves low surface roughness and improves the precision and the quality of the surface of the polished silicon wafer. The refined polishing composition liquid has readily available raw materials, avoids pollution, meets the environmental requirement and can perform large-scale production easily.