Contact device for a power semiconductor module

The invention discloses a contact device for a power semiconductor module, comprising an elastic contact element comprising a contacting-end section (18) that is provided for connection with a connection element (14) of a flat circuit carrier (12) of the power semiconductor module. The contacting-end section (18) is simply linearly formed in the pin shape and the connection element (14) comprises a chip component (10) with a centering recess (16) for the contacting-end section (18) for the elastic contact element. The contact device has simple construction and ensures constant contact feature on the total service life of the power semiconductor module.