Capsule for micro-sensors, processes for the encapsulation of micro-sensors and cap element

Capsule for microsensors, with a first casing element (10), and a second casing element (20) which is connected to the first casing element (10) about an interior space between the capsule elements (10, 20) form, marked by at least one metallization (22, 26) as a bond to join the two capsule elements (10, 20) and simultaneously serves as a contact for an electrically conductive connection from the inside to the outside, wherein the metallization (22, 26) with at least one electrically conductive Contact bushing (13, 14, 15) is electrically conductively connected, extending through the first casing element (10) and / or extends through the second casing element (20).