Evaluation ofInkjet Technology forElectronic Packaging andSystemIntegration

Themaintrend oftheelectronic packaging industry has beenonincreasing thepackaging density andincreasing the functionality, butnow alsotheinterest on flexible manufacturing hasgrown.Inthispaper, we discuss the utilization oftheinkjet technology fortheelectronic packaging andsystem integration. Inkjet technology provides fully-additive non-contacting deposition methodthatis suitable forflexible production. Inthis paper, wedemonstrate thecapability oftheinkjet technology fortheprintable electronics through ahighly-integrated RF SiPapplication, whichismanufactured partly byinkjet printing. TheSiP contains discrete components andanASICwithaminimum pitch of136pimandthesize ofpadsis65pim. Thewidth of lines/spaces isdesigned witharule of75ptm/75 ptm, butalso narrower lines canbeprinted. Thewidth oflines depends on theproperties ofsurface, ink,anddropvolume. The properties ofthesurface canbemanipulated withproper surface treatment. Inthis paper, almost 20% decrease ina diameter ofdropisreported whenthesurface treatment is used.