The semiconductor package

The semiconductor package includes a substrate, a chip, package, and the heat dissipation plate structure layer barb. Chip is disposed on the substrate. Coated chip package and having an upper surface. Heat dissipation plate having a roughened surface, the heat radiating plate to form a roughened surface on the upper surface of the package body. Barb structure layer coated roughened surface and between the package and the heat radiating plate, to improve the binding between the heat radiating plate package.