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The Increase Factor of Residual Stress and the Suppression on Thick Films Prepared by Copper Sulfate Plating
The Increase Factor of Residual Stress and the Suppression on Thick Films Prepared by Copper Sulfate Plating
2015
Keisuke Ogura
Yosuke Abe
Masami Shibata
Keywords:
Metallurgy
Inorganic chemistry
Materials science
Sulfate
Copper
Residual stress
copper sulfate
Correction
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