Application of EBSP to directional solidified Ni3Al

Abstract A new method called EBSP (electron back scattered pattern) is applied to directional solidified Ni 3 Al alloy. The statistic of the GB that is usually implemented only in TEM can be carried out in SEM too. From OIM (orientation imaging microscopy) of both samples, the statistic of coincide site lattice (CSL) of dendrite GB can be acquired. Through the statistic, percentage of boundary in the longitudinal and transverse direction of both samples can be obtained.