Arrangement and method for producing same

An arrangement (100) is provided. The assembly (100) may include: a bare chip (102), the at least one electronic component (104) and a first terminal (106) on a first side (108) of the bare chip (102) and a second terminal (110) on a second side (112) of the bare chip (102) opposite which the first side (108), wherein the first side (108) is the main processing side of the bare chip (102) and the bare chip (102) further comprises at least a third terminal (114) on having the second side (112); providing a first electrically conductive structure (116), the current flow from the third port (114) on the second side (112) of the bare chip (102) to the first side (108) through the bare chip (102); a second electrically conductive structure (118) on the first side (108) of the bare chip (102) that couples the second port (110) laterally with the first electrically conductive structure (116); and an encapsulating material (120) disposed over at least the first side (108) of the bare chip (102) to cover the first port (106) and the second electrically conductive structure (118).