Cryogenic Nano-Aerosol: Particle Removal and Damage-Free Cleaning for IC Manufacturing

Cryogenic Nano-Aerosol dry cleaning is an enabling technology for defect removal on substrates where wet cleaning techniques are not practical or are difficult to implement [1–4]. Example substrates are hydrophobic low-k films, films containing corrosion sensitive metals and high aspect ratio structures prone to stiction or collapse after wet processing. Progress in integrated circuit [IC] manufacturing requires advances in cleaning technologies, particularly small particle removal with minimal material loss and no change in film properties. In response to these requirements, a cryogenic aerosol cleaning technology was developed to meet and exceed IC manufacturing requirements [5]. Details of the generation and properties of the cryogenic Nano-Aerosol and its application for particle removal and damage-free processing will be reviewed.