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OS20-2-4 Warpage of Si/Solder/OFHC-Cu Layered Structures Subjected to Cyclic Thermal Loading
OS20-2-4 Warpage of Si/Solder/OFHC-Cu Layered Structures Subjected to Cyclic Thermal Loading
2011
Hisashi Tanie
Masatoshi Tsuda
K Nakane
Yusuke Urata
N. Ohno
Keywords:
Soldering
Composite material
Materials science
Thermal
Correction
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