Reflow soldering equipment

The invention discloses reflow soldering equipment which comprises a plurality of warm areas and a PCB (printed circuit board) drive mechanism for transmitting PCB boards in the warm areas, at least two warm areas are arranged along the vertical direction and from up to down, and the PCB drive mechanism at least comprises an vertical transmission guide for transmitting PCB boards among the warm areas arranged from up to down. The reflow soldering equipment can effectively utilize the production site, save the floor area, reduce the energy consumption, provide convenience for the transmission, and solve the problem that the after the transmission guide is heated, the distortion is easy to occur such that the PCB boards may be dropped and the transmission is not steady.