Water-cooling heat dissipation scheme of FC (Flip Chip) encapsulation chip

The invention provides a scheme which is beneficial for heat dissipation of an FC (Flip Chip) encapsulation chip by taking an FC structure as a starting point. The scheme is characterized in that a water (or other liquid) circulating cooling system is established, two surfaces of the FC encapsulation chip are provided with capillary pipelines, meanwhile, the two surfaces are respectively provided with a heat dissipation sheet metal group, the pipelines still pass through in a capillary shape, and a micro pump is used as a power source. The heat dissipation mode has the advantages that the flowing speed of liquid in the capillary pipelines is faster, heat can be rapidly taken away, better heat dissipation efficiency can be obtained, and both chips and cooling fins have better heat dissipation efficiency; the double-surface liquid-cooling heat dissipation efficiency is higher than the air heat dissipation efficiency; an original mechanism which realizes heat dissipation through a contact cannot be affected by a system.