Acceptance of the Women's Movement Across Time and Generations: A Mother/Daughter Study

In a method for manufacturing a heat radiating resin-molded semiconductor device, a protrusion is formed on a side peripheral surface of a semiconductor chip, and the semiconductor chip is sealed with resin, so that spreading of the resin toward a back surface of the semiconductor chip is prevented by the protrusion. Also, a heat radiator is mounted on a back surface of the semiconductor chip.