Film for protective film formation and composite sheet for protective film formation

A film for protective film formation, which contains an energy ray-curable compound (B) and has the characteristics described below, and which is used for the purpose of forming a protective film on the back surface of a semiconductor wafer or a semiconductor chip. If a cured product is obtained by curing this film for protective film formation by means of energy ray irradiation, the cured product has a Young's modulus of 500 MPa or more and an elongation at break of 8% or more.