A study of the curing behavior of polyamic acid coated on a Cu or Zn layer

Abstract ZnO and Cu 2 O nanoparticles can be formed through the thermal decomposition of the complex between Zn or Cu with polyamic acid (PAA), accompanying with the formation of polyimide (PI). Transmission electron microscopy (TEM) analysis showed that the formation of ZnO nanoparticles needs a longer curing time than that of Cu 2 O. Fourier transform infrared spectroscopy (FT-IR) characterization shows that both Zn and Cu will delay the imidization process of PAA. However, the retarding degree of imidization process is higher for Zn than that of Cu. Further investigation showed the structure of Zn–PAA complex is different from that of Cu–PAA, which is the reason for the difference of initial imidization temperature. Thermogravimetric and differential thermal analysis (TG–DTA) characterization agrees well with the results of FT-IR. Also, the thermal decomposition temperature of the polyimide was changed by the involvement of Zn or Cu during curing.