The Open Domain-Specific Architecture

Chiplet technology can significantly reduce the cost and time needed to develop custom high performance silicon products. In order to realize a Chiplet-based product, a die-to-die (D2D) network to interconnect the chiplets is required. Almost all of today’s chiplet-based products use proprietary D2D interfaces. Industry has primarily paid attention to PHY connectivity between chiplets in a package. A design also requires logical information flow between chiplets. Current designs use proprietary logic protocols between components. This approach makes it challenging to integrate chiplets from multiple vendors. The Open Domain-Specific Architecture (ODSA) is a project within the Open Compute Project (OCP) community that aims to establish open physical and logical D2D interfaces for chiplets. Ultimately, ODSA aims to create a marketplace of interoperable chiplets from multiple vendors based on open interfaces. This will allow product designers to develop best in class chiplets and System-In -a-Package (SIP) from multiple vendors. This paper reviews technical developments within the ODSA.