Method for processing blind hole with ultraviolet laser

The invention discloses a method for processing a blind hole with ultraviolet laser, which comprises the steps of first processing a central positioning blind hole at a set position with fixed point pulse and then performing hole expansion on the central positioning blind hole by a concentric scanning method. Particularly, the step of processing the central positioning blind hole with the fixed point pulse is performed by first selecting the diameter of the light spot and then selecting the pulse quantity, namely the drilling delay time. In the fixed point drilling process, the diameter of the used light spot is 0.01 to 0.05mm; and the used pulse quantity is determined by the drilling delay mode and the drilling duration is 1,000 to 10,000 microseconds. After the processing of the centralpositioning blind hole is finished, the remaining region outside the central positioning blind hole to be expanded is processed with ultraviolet laser beams at fixed intervals by the concentric scanning method; and finally the residue is transversely or longitudinally removed with low energy light wave. Compared with the prior art, the method ensures little high molecular residue in the blind hole and smooth inner surface of the blind hole; and the removal rate of polymer on a copper-coated surface and the evaporation and volatilization rate of the molten material are high.