High Performance mm-Wave MIMO Radar with Integrated Antenna-on-Package

This paper presents development of antenna-on-package devices using TI’s 77GHz and 60GHz mm-wave radar chips. Two test devices, based on two configurations of flip-chip packaging technology, are designed and characterized to demonstrate electrical performance and mechanical reliability of this solution. A cavity-backed E-shape antenna element is proposed for integration in the package substrate. Antenna elements are arranged on the package to create desired MIMO arrays. On-package impedance matching techniques are used to enable wide-band match between antennas and on-die active circuitry. Arrays of electromagnetic band gap structures (EBG) are designed and implemented in areas around transmit and receive antennas to improve isolation as well as antenna radiation patterns. Measurements of functional device and antenna substrate show good correlation to design simulations.