Adhesive, the adhesive member, a semiconductor mounting wiring board with an adhesive member and a semiconductor device using the same

PROBLEM TO BE SOLVED: To provide an adhesive capable of securing the pot life at 25 deg.C of three months or longer without losing the low elasticity, heat resistance and moisture resistance that are necessary at the time of mounting a semiconductor chip on a printing wiring board has a larger difference in the thermal expansion coefficient from the tip and is called an interposer for a glass epoxy substrate or flexible substrate. SOLUTION: The adhesive contains 100 pts.wt. of (1) an epoxy resin and a curing agent; 75-300 pts.wt. of (2) an epoxy group-containing acrylic copolymer, which contains 0.5-6 wt.% of glycidyl(meth)acrylate and has a Tg (a glass transition temperature) of -10 deg.C or higher and a weight-average molecular weight of 800,000 or more; and 0.1-20 pts.wt. of (3) a latent curing accelerator.