Ground planes resonance suppression technique of glass interposer using high-resistivity via holes for high-speed serial links

System in package with glass interposers have been proposed to enable continuing improvements in communication performance and computing performance. One issue posed by glass interposers is the plane resonance resulting from low dielectric loss. This paper proposes a ground plane resonance suppression technique suitable for glass interposers using resistive vias. Placing high resistivity vias at each corner of plane effectively suppresses resonance. The optimal resistance is at the inflection point of the resonance frequency, or around 5 ohm for a 30 mm square glass interposer.