Flip chip light emitting device and method of manufacturing the same

A light emitting device having a flip chip structure is provided. Epi layer is grown on the first laminate substrate. The second substrate is laminated via the metal bonding (metal bonding) layer on the epitaxial layer. Through-hole electrodes are n-type through-hole (through hole) in the form of electrodes, the first substrate, the epi layer and the second was placed to the bottom of the second substrate face down the second substrate, a conductive vertically penetrating in from the bottom second substrate It is generated by connecting the material. In this case, the first substrate is removed after creating through-hole electrodes. According to the invention, the through-hole (through hole) by developing the LED chip having the electrode shape, and a large number high-density integrated mounted on the circuit board, and securing inherently uniformity of light output and the light irradiation, continuously prism or or large the separate mounting of the lens system to the UV LED outside, it is possible to improve the illumination uniformity and the focusing characteristics.