Anisotropic conductive adhesion of microsensors applied in the instance of a low pressure sensor

An assembly technology that has received a few attention up to now in the area of microsensors is anisotropic conductive sticking, which is already state-of-the-art in the bonding of LCD displays. This procedure was investigated for microsensors application and used for a low pressure sensor as practical example. In addition to an improvement in the medium resistance, the temperature-dependent offset drift could be reduced by a factor of about 10.