Basic properties of AlN layers deposited onto SiC

Summary form only given. AlN films were deposited on silicon carbide wafers by RPP (Reactive Pulse Plasma) method. Basic properties of the AlN layers and AlN-SiC interface have been investigated. We have extracted electrical properties from current-voltage characteristics, investigated surface structure by scanning electron microscopy (SEM), chemical composition of AlN layers by secondary ion mass spectroscopy (SIMS) and layer thickness by spectroscopic ellipsometry measurements.