Laminating and demolding method and device for semi-automatic solder paste printer

The invention relates to the field of semi-automatic solder paste printers for producing circuit boards, in particular to a laminating and demolding method and a laminating and demolding device for semi-automatic solder paste printers for producing circuit boards. The device comprises a base frame body, wherein the base frame body is connected with a cylinder; and a side plate for fixing a scraper system and a steel net is connected with the cylinder and can move with the operation of the cylinder. The base frame body is also provided with a step motor, wherein the output mechanism of the step motor is connected with the cylinder; through the combination of the step motor and the cylinder, the cylinder can control the side plate fixed with the scraper system and the steel net to move quickly and the step motor controls the side plate to move slowly, so that the laminating and demolding speed are controlled effectively. When the laminating and demolding method and the corresponding device are used, the rigid contact between the steel net with a printed circuit board (PCB)/(flexible PCB)FPC to be printed can be avoided and the probability of the damage to the steel net in a laminating process can be lowered; and in a demolding process, the solder paste icicles can be reduced obviously, the solder paste forming is regular and the solder paste printing quality is assured.