Study of Advanced Fan-Out Packages for Mobile Applications

As artificial intelligence technologies has been rapidly applied for mobile devices, the demand is increasing to improve the performance of neural network inference at smart phones. However, conventional package-on-package (PoP) for application processors (AP) and DRAM in smart phones is becoming very difficult to deliver high performance due to heat dissipation issues, and limited memory bandwidth. In this paper, we present thermal, electrical performance and form factor comparison of various mobile package structures such as interposer PoP(i-PoP), fan-out PoP(FO-PoP), and fan-out SiP(FOSiP) side-by-side (SbS). In conclusion, fan-out PoP was suitable for form factor-driven mobile sets and fan-out SiP side-by-side was appropriate for performance-driven mobile sets.