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Effect of Sn-3.0Ag-0.5Cu-3.0Bi solder on microstructure of vacuum soldered joints of SiCP/6063Al composite
Effect of Sn-3.0Ag-0.5Cu-3.0Bi solder on microstructure of vacuum soldered joints of SiCP/6063Al composite
2016
Fan Xiaojie
Xu Dongxia
Wang Peng
Niu Jitai
Wang Dongbin
Chen Sijie
Keywords:
Microstructure
Soldering
Composite material
Engineering
Mechanical engineering
Composite number
Correction
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